Research output per year
Research output per year
Project Details
| Short title | Flex-Si-Sens |
|---|---|
| Acronym | Flex-Si-Sens |
| Status | Finished |
| Effective start/end date | 8/10/18 → 31/08/20 |
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Research output
- 2 Article
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ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics
Yoon, D-J., Malik, M-H., Yan, P., Paik, K-W. & Roshanghias, A., 2 Jan 2021, In: Journal of Materials Science: Materials in Electronics. 32Research output: Contribution to journal › Article › peer-review
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Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates
Roshanghias, A., Rodrigues, A. D. & Holzmann, D., May 2020, In: Microelectronic Engineering.Research output: Contribution to journal › Article › peer-review