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Flexible biomarker testing with wireless communication platform
Roshanghias, Ali
(PI)
Heterogeneous Integration Technologies (HIT)
Overview
Fingerprint
Research output
(2)
Project Details
Short title
Flex-Si-Sens
Acronym
Flex-Si-Sens
Status
Finished
Effective start/end date
8/10/18
→
31/08/20
View all
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Fingerprint
Explore the research topics touched on by this project. These labels are generated based on the underlying awards/grants. Together they form a unique fingerprint.
polyethylene terephthalate
Physics & Astronomy
100%
electronics
Physics & Astronomy
46%
cycles
Physics & Astronomy
44%
chips
Physics & Astronomy
35%
kits
Physics & Astronomy
31%
soldering
Physics & Astronomy
28%
silicon
Physics & Astronomy
23%
electrical properties
Physics & Astronomy
16%
Research output
Research output per year
2020
2020
2021
2021
2
Article
Research output per year
Research output per year
ACF bonding technology for paper- and PET-based disposable flexible hybrid electronics
Yoon, D-J.
,
Malik, M-H.
,
Yan, P.
,
Paik, K-W.
&
Roshanghias, A.
,
2 Jan 2021
,
In:
Journal of Materials Science: Materials in Electronics.
32
Research output
:
Contribution to journal
›
Article
›
peer-review
polyethylene terephthalate
100%
electronics
46%
cycles
44%
chips
35%
kits
31%
Thermosonic fine-pitch flipchip bonding of silicon chips on screen printed paper and PET substrates
Roshanghias, A.
,
Rodrigues, A. D.
&
Holzmann, D.
,
May 2020
,
In:
Microelectronic Engineering.
Research output
:
Contribution to journal
›
Article
›
peer-review