Projects per year
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Collaborations and top research areas from the last five years
Projects
- 1 Finished
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UltimateGaN: Research for GaN Technologies, devices and applications to address the challenges of the future GaN roadmap
Binder, A. (PI), Roshanghias, A. (CoPI), Moldaschl, T. (CoI), Grosso, G. (CoI), Frank, A. (CoI), Lenzhofer, M. (CoI) & Sinani, T. (CoI)
1/05/19 → 31/10/22
Project: Research
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A New Data Fitting Method for Parasitic Impedances of Power Transistor Packages using Two-Port S-Parameter Measurements
Moldaschl, T., Woetzel, S., Galvano, M., Mayer, C., Hackl, H. & Binder, A., 10 Mar 2023, IEEE Annual Southern Power Electronics Conference (SPEC).Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Design and Multiphysics Simulation of a PCB-Embedded-Package Enclosing a Gallium Nitride System on Chip Grown on a Novel Substrate
Pradhan, A., Moldaschl, T., Hasan, M. N., Schicker, J., Binder, A. & De Doncker, R. W., 4 Jul 2023, PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag GmbH, p. 2075-2079 5 p.Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Printed wireless battery-free sensor tag for health monitoring of polymer composites
Rauter, L., Zikulnig, J., Moldaschl, T., Holzmann, D., Neumaier, L., Khalifa, M., Zangl, H., Faller, L.-M. & Kosel, J., 18 May 2023, (E-pub ahead of print) In: IEEE Journal on Flexible Electronics.Research output: Contribution to journal › Article › peer-review
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Sustainable Multifunctional Biface Sensor Tag
Rauter, L., Zikulnig, J., Moldaschl, T., Lenzhofer, M., Khan, S. M., Neumaier, L., Lengger, S., Beduk, T., Malik, M. H., Jose, M., Zangl, H. & Kosel, J., 3 Jan 2023, (E-pub ahead of print) In: Advanced Sensor Research.Research output: Contribution to journal › Article › peer-review
Open Access -
Printed wireless battery-free humidity sensor for integration into lightweight construction parts
Rauter, L., Zikulnig, J., Moldaschl, T., Holzmann, D., Zangl, H., Faller, L.-M. & Kosel, J., Jun 2022, (E-pub ahead of print) IEEE International Conference on Flexible, Printable Sensors and Systems. 4 p.Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
Open Access
Prizes
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Cover Picture of Advanced Sensor Research
Rauter, L. (Recipient), Zikulnig, J. (Recipient), Moldaschl, T. (Recipient), Lenzhofer, M. (Recipient), Khan, S. (Recipient), Neumaier, L. (Recipient), Lengger, S. (Recipient), Bedük Ashirova, T. (Recipient), Malik, M. H. (Recipient), Jose, M. (Recipient), Zangl, H. (Recipient) & Kosel, J. (Recipient), 10 Mar 2023
Prize
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IEEE-5E Contest Winner - "Best electronics product developed in-house by any interested party"
Khan, S. (Recipient), Rauter, L. (Recipient), Zikulnig, J. (Recipient), Moldaschl, T. (Recipient), Lenzhofer, M. (Recipient), Neumaier, L. (Recipient), Lengger, S. (Recipient) & Kosel, J. (Recipient), 27 Apr 2021
Prize
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RFID-based Wireless Sensor Network for Semiconductor Manufacturing Equipment to enable Predictive Maintenance
Moldaschl, T. (Speaker)
16 Nov 2021Activity: Talk or presentation › Invited talk
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RFID-based Wireless Sensor Network for Semiconductor Manufacturing Equipment to enable Predictive Maintenance
Moldaschl, T. (Speaker)
2019Activity: Talk or presentation › Oral presentation