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Collaborations and top research areas from the last five years
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Characterisation of Thermal Interface Materials under Sustained Cyclic Thermo-Mechanical Loading
Matzick, P., Beligoj, M., Mollov, S. & Mentin, C., 24 Sept 2025, Proceedings Therminic 2025. 2025 ed. Naples, Italy, Vol. 2025 31st International Workshop on Thermal Investigations of ICs and Systems (THERMINIC).Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Thermo-Mechanical Investigations for PCB Assemblies Using Top-side Cooled Power Devices
Matzick, P., Mentin, C., Adelbrecht, L., Anes Romero, E. & Petrella, R., 25 Sept 2024, Proceedings Therminic 2024.Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Energy Management Algorithm for Battery Sharing based on Model Predictive Control integrating Electro-Thermal Simulation and Demand Forecast
Hackl, H., Freiberger, M., Matzick, P., Stoiber, M. & Auinger, B., 27 Sept 2023, 2023 International Conference on Electrical Drives and Power Electronics (EDPE). p. 1-7 7 p. 10274028Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Tiny Power Box – Mechanical Investigations for Automotive Very High Power Density Onboard Chargers
Recepi, I., Mentin, C., Matzick, P. & Garcia Mora, R. A., 4 Jul 2023, PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. p. 1-9 9 p. 10173332Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Design of Innovative Thermal Management Solutions for High Density Power Electronic Applications
Matzick, P., 14 Oct 2022, 89 p.Research output: Types of Thesis (Published) › Master's Thesis
Prizes
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OVE Innovation Award
Langbauer, T. (Recipient), Vollmaier, F. (Recipient), Connaughton, A. M. (Recipient), Mentin, C. (Recipient), Recepi, I. (Recipient), Matzick, P. (Recipient), Aqeel, S. (Recipient), Konrad, W. (Recipient), Krall, R. (Recipient) & Adelbrecht, L. (Recipient), 17 Nov 2022
Prize
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SEMIKRON Innovation Award 2023
Langbauer, T. (Recipient), Mentin, C. (Recipient), Connaughton, A. M. (Recipient), Vollmaier, F. (Recipient), Pajnic, M. (Recipient), Recepi, I. (Recipient), Adelbrecht, L. (Recipient), Matzick, P. (Recipient) & Konrad, W. (Recipient), 28 Mar 2023
Prize
Activities
- 1 Oral presentation
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Thermo-Mechanical Investigations for PCB Assemblies Using Top-side Cooled Power Devices
Matzick, P. (Speaker)
25 Sept 2024Activity: Talk or presentation › Oral presentation