Research output per year
Research output per year
- 11 results
Search results
-
2022
Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging
Roshanghias, A., Bardong, J. & Binder, A., 11 Apr 2022, In: Materials.Research output: Contribution to journal › Article › peer-review
Open AccessFile -
2021
Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging
Roshanghias, A., Malago, P., Kaczynski, J., Polom, T., Bardong, J., Holzmann, D., Malik, M-H., Ortner, M., Hirschl, C. & Binder, A., 13 Apr 2021, In: Energies. 14, 8Research output: Contribution to journal › Article › peer-review
Open Access -
2020
Vacuum-Assisted Selective Adhesive Imprinting for Photonic Packaging of Complex MOEMS Devices: Assembly of Miniaturized Particle Sensor
Pribosek, J., Zauner, M., Bardong, J., Binder, A., Maierhofer, P., Bergmann, A. & Röhrer, G., 15 Jan 2020, In: IEEE Sensors Journal. 20, 24, p. 15053-15060 8 p., 9146292.Research output: Contribution to journal › Article › peer-review
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2019
RFID-based Wireless Sensor Network for Semiconductor Manufacturing Equipment to enable Predictive Maintenance
Moldaschl, T., Travnik, A., Frank, A., Bardong, J., Cramer, H., Kastberger, H., Weitlaner, M., Jerne, M., Nazarov, A. & Hirschl, C., Apr 2019, In: Proceedings of the 13th international conference on Smart Systems Integration.Research output: Contribution to journal › Article
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Wireless readout of multiple SAW temperature sensors
Bruckner, G. & Bardong, J., 2 Jul 2019, In: Sensors. 19, 14Research output: Contribution to journal › Article › peer-review
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2018
A novel interferometric characterization technique for 3D analyses at high pressures and temperatures
Roshanghias, A., Bardong, J., Pulko, J. & Binder, A., 28 Mar 2018, In: Journal of Physics D: Applied Physics. 51, 16Research output: Contribution to journal › Article › peer-review
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2016
Investigation of low-temperature cofired ceramics packages for high-temperature SAW sensors
Bardong, J., Binder, A., Toskov, S., Miskovic, G. & Radosavljevic, G., 17 Mar 2016, In: Journal of Sensors and Sensor Systems. 5, 1, p. 85-93 9 p.Research output: Contribution to journal › Article › peer-review
Open Access -
Multilayer Pt/Al based ohmic contacts for AlGaN/GaN heterostructures stable up to 600°C ambient air
Goyal, N., Dusari, S., Bardong, J., Medjdoub, F., Kenda, A. & Binder, A., 1 Feb 2016, In: Solid-State Electronics. 116, p. 107-110Research output: Contribution to journal › Article › peer-review
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2014
Development of a Low Cost, Miniature Thermal Conductivity Vacuum Gauge for Integration Purposes
Lenzhofer, M., Bardong, J., Nicolay, P. & Kenda, A., Aug 2014, In: International Journal of Computer and Electronics Research. 2014, 4, p. 177 - 180Research output: Contribution to journal › Article › peer-review
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2012
Iridium interdigital transducers for high-temperature surface acoustic wave applications
Aubert, T., Bardong, J., Elmazria, O., Bruckner, G. & Assouar, B., 1 Feb 2012, In: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control. 59, 2, p. 194-197 4 p., 6156820.Research output: Contribution to journal › Article › peer-review
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2008
High-Temperature Measurements on SAW-Substrate Langasite
Bardong, J., Mayer, E. & Reindl, L., 1 Mar 2008, In: EFTF 2008 - 22nd European Frequency and Time Forum conference proceedings. 1 p.Research output: Contribution to journal › Article › peer-review