Projects per year
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Dive into the research topics where Ali Roshanghias is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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FOWLP: Advanced Wafer-Level packaging Pilot line: Fan Out Wafer Level Packaging
Roshanghias, A. (PI)
1/10/23 → 30/09/26
Project: Research
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Nano4E: Integrated thermo-optically activated Nanosensors for environmental monitoring
Roshanghias, A. (PI)
1/05/23 → 30/04/26
Project: Research
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PowerizeD: Digitalization of Power Electronic Applications within Key Technology Value Chains
Roshanghias, A. (PI)
1/01/23 → 1/12/25
Project: Research
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ALL2GaN: Affordable smart GaN IC solutions as enabler of greener applications
Roshanghias, A. (PI)
1/01/23 → 1/12/25
Project: Research
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All-in-Crystal: Entwicklung eines miniaturisierten, hochtemperaturtauglichen, passiv funkabfragbaren Surface Acoustic Wave Sensorelements
Roshanghias, A. (PI)
1/02/22 → 31/01/25
Project: Research
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Design, Performance, and HTOL Evaluation of a Monolithic 100 V/25 A GaN IC Module
Benli-Marin-Palomo, Ö., Roshanghias, A. & Ain, K. N., 22 Mar 2026, 2026 IEEE Applied Power Electronics Conference and Exposition (APEC).Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Experimental-numerical framework for failure mechanism identification and material selection in Cu Sinterconnect® technology
Ain, K. N., Grosso, G., Nitsch, V., Scheiter, L., van Driel, W., Zhang, G. Q. & Roshanghias, A., 30 Jun 2026, (Submitted) Experimental-numerical framework for failure mechanism identification and material selection in Cu Sinterconnect® technology.Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Nanowire-foil Sinterconnect®: Sintered Planar Topside Interconnect for Wire-Bond-Free Power Packaging
Ain, K. N., Quednau, S., Nitsch, V., Hasan, M. N., Adelbrecht, L., van Driel, W., Zhang, G. Q. & Roshanghias, A., 30 Jun 2026, (Submitted) Nanowire-foil Sinterconnect®: Sintered Planar Topside Interconnect for Wire-Bond-Free Power Packaging.Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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Polymer-Cu hybrid bonding with damascene-based Cu structuring on polyimide dielectric layer
Rodrigues, A. D., Malik, M. H., Massarwa, M., Yaghtin, B., Bin Zulkefli, M. A., Pretschuh, P., Jukei, M., Nomura, K., Tanigaki, Y., Fujiwara, T., Araki, H. & Roshanghias, A., 21 Jun 2026, (Submitted) 2026 IEEE 11th Electronics System-Integration Technology Conference (ESTC) proceedings .Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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3D-Printed Assembly Including Micro-Optics for Efficient Direct Light Coupling
Khan, M. S., Shishkin, I., Roshanghias, A. & Tortschanoff, A., 15 Aug 2025, 2025 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC).Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review