Projects per year
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Dive into the research topics where Ali Roshanghias is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Collaborations and top research areas from the last five years
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FOWLP: Advanced Wafer-Level packaging Pilot line: Fan Out Wafer Level Packaging
Roshanghias, A. (PI)
1/10/23 → 30/09/26
Project: Research
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Nano4E: Integrated thermo-optically activated Nanosensors for environmental monitoring
Roshanghias, A. (PI)
1/05/23 → 30/04/26
Project: Research
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PowerizeD: Digitalization of Power Electronic Applications within Key Technology Value Chains
Roshanghias, A. (PI)
1/01/23 → 1/12/25
Project: Research
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ALL2GaN: Affordable smart GaN IC solutions as enabler of greener applications
Roshanghias, A. (PI)
1/01/23 → 1/12/25
Project: Research
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All-in-Crystal: Entwicklung eines miniaturisierten, hochtemperaturtauglichen, passiv funkabfragbaren Surface Acoustic Wave Sensorelements
Roshanghias, A. (PI)
1/02/22 → 31/01/25
Project: Research
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3D-Printed Assembly Including Micro-Optics for Efficient Direct Light Coupling
Khan, M. S., Shishkin, I., Roshanghias, A. & Tortschanoff, A., 15 Aug 2025, 2025 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC).Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
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From Lab to Fab: Bringing MEMS Vapor Cells Closer to Application
Bruckner, G., Roshanghias, A., Riedrich-Möller , J. & Groemer, T., 20 Sept 2025, From Lab to Fab: Bringing MEMS Vapor Cells closer to Application. Vol. September. p. 11-18 7 p. 2Research output: Conference proceeding/Chapter in Book › Chapter › peer-review
Open Access -
Integrated circuit for capacitive sensing in collaborative robotics
Sturm, J., Roshanghias, A. & Zangl, H., 6 Oct 2025, In: e & i Elektrotechnik und Informationstechnik. p. 1-11Research output: Contribution to journal › Article › peer-review
Open Access -
Photonic Debonding for Through Silicon Wafer Processing
Rodrigues, A. D., Akhavan, V., Chou, H., Turkani, V. & Roshanghias, A., 2 Dec 2025, WaferBond'25: Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration. p. 127-128Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review
File -
An Introduction to Wire-Bondless Discrete GaN Power Packages With Top-Side Cu Sinterconnects®
Ain, K. N., Zhang, G. Q., Rodrigues, A. D., Hasan, M. N., Holzmann, D., Geens, K., Chatterjee, U. & Roshanghias, A., 13 Sept 2024, 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). p. 1-5 5 p. 10712025Research output: Conference proceeding/Chapter in Book › Conference Paper › peer-review