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Dive into the research topics where Alfred Binder is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Projects
- 1 Active
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Die-Level Thinning for Flip-Chip Integration on Flexible Substrates
Malik, M. H., Tsiamis, A., Zangl, H., Binder, A., Mitra, S. & Roshanghias, A., 8 Mar 2022, In: Electronics.Research output: Contribution to journal › Article › peer-review
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Evaluating Cu Printed Interconnects “Sinterconnects” versus Wire Bonds for Switching Converters
Hasan, M. N., Polom, T., Holzmann, D., Malagó, P., Binder, A. & Roshanghias, A., 25 Apr 2022, In: Electronics.Research output: Contribution to journal › Article › peer-review
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Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging
Roshanghias, A., Bardong, J. & Binder, A., 11 Apr 2022, In: Materials.Research output: Contribution to journal › Article › peer-review
Open AccessFile -
Comparison of the parasitic Impedances from the Drain-Source Path of Power Transistor Packages at up to 2 GHz
Moldaschl, T., Woetzel, S., Latella, R., Galvano, I. & Binder, A., 2021, In: Engineering Reports.Research output: Contribution to journal › Article › peer-review
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Cu Pillar Planarization to Enhance Thermosonic Flipchip Bonding: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Roshanghias, A., Rodrigues, A., Kaczynski, J., Binder, A. & Schmidt, A., 1 Nov 2021, p. 1-3. 3 p.Research output: Contribution to conference (No Proceedings) › Paper › peer-review