Engineering & Materials Science
3D modeling
14%
3D printers
36%
Acoustic impedance
63%
Acoustic surface wave devices
26%
Acoustic waves
77%
Adhesives
33%
Antennas
23%
Battery Pack
29%
Capacitors
28%
Ceramic capacitors
15%
Charging (batteries)
14%
Circuit simulation
20%
Coaxial cables
15%
Communication
14%
Communication systems
15%
Computer simulation
15%
Controllers
18%
Cooling
18%
Cooling systems
14%
Copper
21%
Costs
20%
Curing
23%
Digital twin
17%
Distributed power generation
20%
Electric bikes
20%
Electric current control
12%
Electric delay lines
15%
Electric network topology
15%
Electric potential
40%
Electric vehicles
30%
Electrohydrodynamics
33%
Electromagnetic compatibility
53%
Electromagnetic simulation
15%
Electronic equipment
43%
Electronic paper
13%
Electroporation
19%
Encapsulation
17%
End effectors
13%
Energy management
25%
Equivalent circuits
47%
Fabrication
36%
Finite element method
15%
Frequency response
42%
Gallium
23%
Grippers
14%
Hearing aids
16%
Heat transfer
16%
High frequency transformers
16%
High temperature applications
23%
Hot Temperature
56%
Identification (control systems)
16%
Inductance
23%
Ink
17%
Low pass filters
13%
Medical applications
13%
Metallizing
14%
Microstrip antennas
27%
Monitoring
35%
Multilayers
33%
Near field communication
93%
Networks (circuits)
28%
Neural networks
20%
Packaging
29%
Patents and inventions
14%
Phase shift
13%
Phototransistors
19%
Plate metal
16%
Polychlorinated biphenyls
22%
Polypropylenes
25%
Power electronics
38%
Power inductors
19%
Power MOSFET
15%
Power transistors
31%
Predictive maintenance
15%
Pressure sensors
15%
Printed circuit boards
38%
Printing
70%
Radio frequency identification (RFID)
33%
Resonators
31%
Scattering parameters
38%
Semiconductor materials
68%
Sensors
75%
Shielding
17%
Signal interference
19%
Silicon
24%
Silver nanoparticles
17%
Soldering alloys
32%
SPICE
16%
Substrates
54%
Surface waves
95%
Temperature
54%
Temperature measurement
28%
Temperature sensors
45%
Topography
13%
Topology
14%
Transistors
13%
Transponders
38%
Ultrasonics
14%
Wire
13%
Wireless power transfer
28%
Physics & Astronomy
acoustics
58%
actuation
8%
adhesion
10%
adhesives
44%
amplifier design
9%
antennas
10%
assemblies
8%
assembly
18%
cathodes
7%
cavities
7%
cells
7%
ceramics
17%
characterization
21%
chips
100%
chutes
10%
connectors
14%
cooling
9%
copper
12%
costs
10%
crystals
8%
curing
13%
cycles
13%
delay lines
18%
electronics
34%
ellipsometry
12%
emerging
7%
end effectors
19%
etching
9%
eutectics
14%
evaluation
17%
fabrication
10%
fluids
12%
gallium
12%
gallium nitrides
19%
gases
9%
glass
24%
gold
8%
gyroscopes
13%
high electron mobility transistors
10%
igniters
9%
ignition
11%
ignition systems
9%
impedance
12%
industries
7%
laser-induced breakdown spectroscopy
15%
manufacturing
10%
masks
10%
mechanical properties
9%
membranes
18%
metal oxides
11%
methodology
14%
microelectromechanical systems
31%
microelectronics
12%
microstructure
16%
modules
12%
oscillations
7%
packaging
43%
performance
36%
photometers
10%
pixels
9%
polychlorinated biphenyls
16%
polyethylene terephthalate
13%
polymers
8%
polypropylene
12%
power lines
8%
pressure sensors
13%
printing
10%
radiant flux density
12%
radio frequencies
26%
Rayleigh waves
14%
readout
22%
resonators
7%
sensors
52%
silicon
40%
silicon carbides
11%
silicon nitrides
12%
silver
10%
simulation
21%
sintering
9%
solders
44%
solid solutions
10%
surface acoustic wave devices
24%
systems-on-a-chip
9%
tellurides
16%
temperature
44%
temperature measurement
11%
temperature sensors
58%
thermal simulation
15%
thermistors
7%
thin films
15%
transducers
33%
transistors
9%
transition metals
10%
vacuum
7%
vapors
9%
wafers
34%
wavelengths
9%
YAG lasers
11%
yttrium
7%