Through-polymer-vias for electrical interconnection between multiple layers in printed electronics

Khan, S. (Speaker)

Sensor Applications (SEA)

Activity: Talk or presentation › Oral presentation

Period	2 Mar 2023
Event title	LOPEC Conference 2023: Driving the future of printed electronics
Event type	Conference
Location	München, GermanyShow on map
Degree of Recognition	International

Documents & Links

https://lopec.com/application/en/program/lopec-conference/lecture/through-polymer-vias-for-electrical-interconnection-between-multiple-layers-in-printed-electronics-1068

Related content

Research output
Through-polymer-vias for electrical interconnection between multiple layers in printed electronics
Research output: Contribution to conference (No Proceedings) › Abstract › peer-review