PAPER-BASED PRINTIED SENSORS FOR IN-SITU MONITORING OF ADHESIVE CURING PROCESS

Activity: Talk or presentationOral presentation

Description

Talk focuses on printed sensing solutions for glue cure monitoring used in wood manufacturers to enhance the production quality. This talk was given in Large-area, Organic and Printed Electronics Convention (LOPEC) held in Munich.
Period28 Feb 20232 Mar 2023
Event titleLarge-area, Organic and Printed Electronics Convention (LOPEC): Printed Sensors
Event typeConference
LocationMunich, GermanyShow on map
Degree of RecognitionInternational