Multi Domain Simulations for Power Electronics, a pathway towards electro-thermal co-simulation

Description

Power electronic systems are nowadays present in all electronic circuits and by high integration it gets less and less visible for the end consumers. Already today wide-bandgap semiconductors help to miniaturize power electronic systems and components and in addition achieve higher efficiency. Nevertheless, the increase in efficiency often can’t follow the increase of power density, when wide-bandgap semiconductors come into play. Higher loss-densities, higher temperatures and stronger thermal crosstalk between components is the result and can lead to hot-spots and resulting decreased lifetime. An accurately modelled, so-called digital twin, is the key when interactions between components start to play a role. This tutorial will point out the impact of geometrical accurate semiconductor package models for simulation, important design decisions and which tools can be used when aiming for electro-thermal coupling.

Period	10 Oct 2022
Event title	2022 Austrochip: 30th Austrian Workshop on Microelectronics
Event type	Conference
Location	Villach, AustriaShow on map
Degree of Recognition	International