Thin Wafer Pre-Align Gripping System – A new mechatronic approach to semiconductor handling

Alfred Binder, Georg Franz, Martin Lenzhofer, M. Soucek

Publikation: Konferenzbeitrag › Papier › Begutachtung

Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2003
Veranstaltung	10th annual IEEE Conference on Mechatronics and Machine Vision in Practice - Perth, Perth, Australien Dauer: 1 Jän. 1993 → …

Konferenz	10th annual IEEE Conference on Mechatronics and Machine Vision in Practice
Land/Gebiet	Australien
Ort	Perth
Zeitraum	1/01/93 → …

Dieses zitieren

@conference{46e0b768db894953a01783cc93a102a5,

title = "Thin Wafer Pre-Align Gripping System – A new mechatronic approach to semiconductor handling",

author = "Alfred Binder and Georg Franz and Martin Lenzhofer and M. Soucek",

year = "2003",

language = "English",

note = "10th annual IEEE Conference on Mechatronics and Machine Vision in Practice ; Conference date: 01-01-1993",

}