On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Ali Roshanghias; Marc Dreissigacker; Christina Scherf; Christian Bretthauer; Lukas Rauter; Johanna Zikulnig; Tanja Braun; Karl-F Becker; Sven Rzepka; Martin Schneider-Ramelow

doi:10.3390/mi11060564

On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers

Ali Roshanghias, Marc Dreissigacker, Christina Scherf, Christian Bretthauer, Lukas Rauter, Johanna Zikulnig, Tanja Braun, Karl-F Becker, Sven Rzepka, Martin Schneider-Ramelow

Sensor Applications (SEA)

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Originalsprache	Englisch
Fachzeitschrift	Micromachines
DOIs	https://doi.org/10.3390/mi11060564
Publikationsstatus	Veröffentlicht - 31 Mai 2020

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10.3390/mi11060564

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https://doi.org/10.3390/mi11060564

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title = "On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers",

author = "Ali Roshanghias and Marc Dreissigacker and Christina Scherf and Christian Bretthauer and Lukas Rauter and Johanna Zikulnig and Tanja Braun and Karl-F Becker and Sven Rzepka and Martin Schneider-Ramelow",

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AU - Roshanghias, Ali

AU - Dreissigacker, Marc

AU - Scherf, Christina

AU - Bretthauer, Christian

AU - Rauter, Lukas

AU - Zikulnig, Johanna

AU - Braun, Tanja

AU - Becker, Karl-F

AU - Rzepka, Sven

AU - Schneider-Ramelow, Martin

PY - 2020/5/31

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DO - 10.3390/mi11060564

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JO - Micromachines

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