Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

A. Yakymovych; Y. Plevachuk; P. Švec; P. Švec; D. Janičkovič; P. Šebo; N. Beronská; A. Roshanghias; H. Ipser

doi:10.1007/s11664-016-4832-7

Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

A. Yakymovych, Y. Plevachuk, P. Švec, P. Švec, D. Janičkovič, P. Šebo, N. Beronská, A. Roshanghias, H. Ipser

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Originalsprache	Englisch
Fachzeitschrift	Journal of Electronic Materials
DOIs	https://doi.org/10.1007/s11664-016-4832-7
Publikationsstatus	Veröffentlicht - 2016

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10.1007/s11664-016-4832-7

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http://www.scopus.com/inward/record.url?eid=2-s2.0-84982931603&partnerID=MN8TOARS

Dieses zitieren

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title = "Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles",

author = "A. Yakymovych and Y. Plevachuk and P. {\v S}vec and P. {\v S}vec and D. Jani{\v c}kovi{\v c} and P. {\v S}ebo and N. Beronsk{\'a} and A. Roshanghias and H. Ipser",

year = "2016",

doi = "10.1007/s11664-016-4832-7",

language = "English",

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TY - JOUR

T1 - Morphology and Shear Strength of Lead-Free Solder Joints with Sn3.0Ag0.5Cu Solder Paste Reinforced with Ceramic Nanoparticles

AU - Yakymovych, A.

AU - Plevachuk, Y.

AU - Švec, P.

AU - Janičkovič, D.

AU - Šebo, P.

AU - Beronská, N.

AU - Roshanghias, A.

AU - Ipser, H.

PY - 2016

Y1 - 2016

UR - http://www.scopus.com/inward/record.url?eid=2-s2.0-84982931603&partnerID=MN8TOARS

U2 - 10.1007/s11664-016-4832-7

DO - 10.1007/s11664-016-4832-7

M3 - Article

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

ER -