Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

Muhammad Hassan Malik, Andreas Tsiamis, Hubert Zangl, Alfred Binder, Srinjoy Mitra, Ali Roshanghias

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Zugriff auf Dokument

@article{5ea1b6bf080444b6a93a60d688d06baf,

title = "Die-Level Thinning for Flip-Chip Integration on Flexible Substrates",

author = "Malik, {Muhammad Hassan} and Andreas Tsiamis and Hubert Zangl and Alfred Binder and Srinjoy Mitra and Ali Roshanghias",

year = "2022",

month = mar,

day = "8",

doi = "10.3390/electronics11060849",

language = "undefiniert/unbekannt",

}

TY - JOUR

T1 - Die-Level Thinning for Flip-Chip Integration on Flexible Substrates

AU - Malik, Muhammad Hassan

AU - Tsiamis, Andreas

AU - Zangl, Hubert

AU - Binder, Alfred

AU - Mitra, Srinjoy

AU - Roshanghias, Ali

PY - 2022/3/8

Y1 - 2022/3/8

UR - https://doi.org/10.3390/electronics11060849

U2 - 10.3390/electronics11060849

DO - 10.3390/electronics11060849

M3 - Artikel

JO - Electronics

JF - Electronics

ER -