Cu Sintering for Cu Pillar Bonding: A Comparative Study among Pressure-less, Pressure-assisted and Transient Liquid Phase sinter pastes

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Originalsprache	Englisch
Fachzeitschrift	IEEE Transactions on Components, Packaging and Manufacturing Technology
DOIs	https://doi.org/10.1109/TCPMT.2024.3501478
Publikationsstatus	Veröffentlicht - 18 Nov. 2024

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@article{0cd3a092f8b0450897efe150a09998ee,

title = "Cu Sintering for Cu Pillar Bonding: A Comparative Study among Pressure-less, Pressure-assisted and Transient Liquid Phase sinter pastes",

author = "Augusto Rodrigues and Julien Magnien and Roland Brunner and Ali Roshanghias",

year = "2024",

month = nov,

day = "18",

doi = "10.1109/TCPMT.2024.3501478",

language = "English",

}

TY - JOUR

T1 - Cu Sintering for Cu Pillar Bonding: A Comparative Study among Pressure-less, Pressure-assisted and Transient Liquid Phase sinter pastes

AU - Rodrigues, Augusto

AU - Magnien, Julien

AU - Brunner, Roland

AU - Roshanghias, Ali

PY - 2024/11/18

Y1 - 2024/11/18

UR - https://doi.org/10.1109/TCPMT.2024.3501478

U2 - 10.1109/TCPMT.2024.3501478

DO - 10.1109/TCPMT.2024.3501478

M3 - Article

JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

ER -