Capacitive MEMS Microphone with Low-Stress Ultra-Thin Vibrating Membrane

Lixiang Wu, Quansheng Sun, Gaofeng Wang, Junli Wang

    Publikation: KonferenzbeitragPapierBegutachtung

    Abstract

    Emerging consumer electronics such as flexible electronics and smart wearables have strong and growing demand for MEMS microphones with small size and high performance. For a capacitive MEMS microphone, however, it is challenging to achieve reduced size and improved acoustic performance at the same time due to a trade-off between the diameter and mechanical compliance of its vibrating membrane. In this work, a capacitive MEMS microphone with a low-stress polysilicon vibrating membrane was developed to breakthrough the tradeoff, which can achieve a signal-to-noise ratio (SNR) as high as 62.3 dBA. Its vibrating membrane has a thickness of only about 100 and a diameter of 600-800 m.
    OriginalspracheEnglisch
    DOIs
    PublikationsstatusVeröffentlicht - 17 Nov. 2020
    VeranstaltungIEEE International Ultrasonic Symposium 2020 - Las Vegas, USA/Vereinigte Staaten
    Dauer: 6 Sep. 202011 Sep. 2020

    Konferenz

    KonferenzIEEE International Ultrasonic Symposium 2020
    Land/GebietUSA/Vereinigte Staaten
    OrtLas Vegas
    Zeitraum6/09/2011/09/20

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