Abstract
Emerging consumer electronics such as flexible electronics and smart wearables have strong and growing demand for MEMS microphones with small size and high performance. For a capacitive MEMS microphone, however, it is challenging to achieve reduced size and improved acoustic performance at the same time due to a trade-off between the diameter and mechanical compliance of its vibrating membrane. In this work, a capacitive MEMS microphone with a low-stress polysilicon vibrating membrane was developed to breakthrough the tradeoff, which can achieve a signal-to-noise ratio (SNR) as high as 62.3 dBA. Its vibrating membrane has a thickness of only about 100 and a diameter of 600-800 m.
Originalsprache | Englisch |
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DOIs | |
Publikationsstatus | Veröffentlicht - 17 Nov. 2020 |
Veranstaltung | IEEE International Ultrasonic Symposium 2020 - Las Vegas, USA/Vereinigte Staaten Dauer: 6 Sep. 2020 → 11 Sep. 2020 |
Konferenz
Konferenz | IEEE International Ultrasonic Symposium 2020 |
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Land/Gebiet | USA/Vereinigte Staaten |
Ort | Las Vegas |
Zeitraum | 6/09/20 → 11/09/20 |