A novel approach to characterize the sodium contamination caused by gas filling during anodic bonding

张 俞骋, Francesco Solazzi, Norbert Cselyuszka, Kurt Sorschag, Nikolai Andrianov, Mannuel Bauscher, Michael Schiffer, Klaus-Dieter Lang, Mohssen Moridi, Martin Schneider-Ramelow

Publikation: Konferenzband/Beitrag in Buch/BerichtKonferenzartikelBegutachtung


In this work, a novel test structure design is proposed for the characterization of sodium (Na) contaminants
during anodic bonding. The new structure can be described as
a sheet-resistivity process control monitor (PCM) based on Ptype piezoresistor with electrical connection that enables direct
measurement after bonding process. This design avoids external
contamination through mechanically opening the structure as
in some previous research, and, thus, ensures a reliable result.
Additionally, the test structure is paired with a twin structure,
which functions as a local reference by shielding the resistor with
metallization to minimize the effect of process deviation. The
designed structure was fabricated at Infineon Technologies AG
and anodically bonded inside an environment with a steady
Na distribution while nitrogen filling profile is controlled to
characterize the influence of gas flow on Na contamination.
After the bonding process, a wafer-level probing was carried out,
which gave a direct result that shows the relationship between
measurement deviation and gas filling parameters
TitelSymposium on Design, Test, Integration & Packaging of MEMS and MOEMS
PublikationsstatusVeröffentlicht - 2022


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