Nikolai Andrianov

2023

Acoustofluidic Trapping in Structured Microchannels Using Lateral Transducer Modes

Fuchsluger, A., De Pastina, A., Mitteramskogler, T., Ecker, R., Voglhuber-Brunnmaier, T., Andrianov, N., Shatalov, A., Cselyuszka, N., Moridi, M. & Jakoby, B., Nov. 2023.

Publikation: Konferenzbeitrag › Papier › Begutachtung

Open Access

Aluminum nitride on insulator: Material and processing optimization for integrated photonic applications

Spettel, J., Andrianov, N., Dubois, F., Furci, H., Cassese, T., Liffredo, M., Villanueva, L. G., Quack, N., Moridi, M. & Dao, T. D., 2023, EPJ Web of Conferences. Band 287.

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Open Access

Design and Fabrication of aluminum nitride integrated photonics devices

Spettel, J., Andrianov, N., Cassese, T., Furci, H., Dubois, F., Quack, N., Moridi, M., Villanueva, L. G. & Dao, T. D., 2023.

Publikation: Konferenzbeitrag › Poster

Dual-frequency piezoelectric MEMS microphones based on AlSc 30% N thin films for aeroacoustic measurements

Wu, L., Zhai, Y., Lokesh, O., Bourquard, C., Abbaszadeh, J., Andrianov, N., Garcia souto, J. A., Nguyen, T. A. T., Chen, X., Erbacher, K., Ngo, H-D., Sainges, O. & Julliard, E., 8 Juni 2023.

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Dual-frequency piezoelectric micromachined ultrasonic transducers for fundamental and harmonic imaging

Zhai, Y., Maqsood, W., Da, Z., Andrianov, N., 张俞骋, Moridi, M. & Wu, L., 2023, IEEE MEMS.

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Datei

Efficient Xe Filling of MEMS Vapor Cells Empowered by Customized Triple Stack Wafer Bond Processing

Roshanghias, A., Kaczynski, J., Rodrigues, A., Hübner, M., Zauner, M., Grosso, G., Andrianov, N., Khan, M., Grömer, T., Fuchs, T. & Binder, A., 29 Sep. 2023, in: ECS Transactions.

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

Engineering Light with Mid-Infrared Metasurfaces for Sensing and Imaging Applications

Dao, T. D., Andrianov, N., Chouiki, M., Azeem, S. M., Spettel, J., Dubois, F., Fleury, C., Pilz, J., Moridi, M. & Vojkuvka, L., Juli 2023.

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Open Access

Highly Selective Plasma Etching Technique for Molybdenum: Highly Selective Plasma Etching Technique for Molybdenum

Osipov, A., Andrianov, N., Speshilova, A., Gagaeva, A., Risquez, S., Vorobyev, A. & Alexandrov, S., 18 Feb. 2023, in: Plasma Chemistry and Plasma Processing. S. 1-11 11 S.

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Open Access

Non-destructive Na content analysis in bonded silicon-glass microcavities using laser-induced breakdown spectroscopy

Bereczki, T., Cselyuszka, N., 张俞骋, Guso, E., Fugger-Schafhauser, D. M., Menezes de Oliveira, B. N., Roshanghias, A. & Andrianov, N., 2023, Optical Waveguide and Laser Sensors II,.

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Soft mask-based dry etching of parylene AF4 for advanced packaging applications

Bellaredj, M. L. F., Andrianov, N., Kaufhold, R. & Miskovic, G., 18 Jän. 2023, S. 109. 113 S.

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Vertical etching of Al0.7Sc0.3N for next generation of acoustic wave resonators

Terzic, T., Andrianov, N., Chouiki, M., Solonenko, D., De Pastina, A., Pashchenko, V. & Risquez, S., 2 Okt. 2023, 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP).

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Open Access

2022

Acoustofluidic Particle Focusing in PMMA Chips Using Low Frequency Lateral Resonances of The Piezoelectric Plate Transducer

Fuchsluger, K., Ecker, K., De Pastina, A., Andrianov, N., Cselyuszka, N., Moridi, M. & Jakoby, B., 2022, 48th international conference on Micro and Nano Engineering - Eurosensors (MNE-ES) .

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A novel approach to characterize the sodium contamination caused by gas filling during anodic bonding

张俞骋, Solazzi, F., Cselyuszka, N., Sorschag, K., Andrianov, N., Bauscher, M., Schiffer, M., Lang, K-D., Moridi, M. & Schneider-Ramelow, M., 2022, Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS. S. 1 5 S.

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Chemically enhanced dry etching of Al0.7Sc0.3N for MEMS applications

Andrianov, N., De Pastina, A., Risquez, S. & Moridi, M., 21 Sep. 2022.

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Fabrication of high-aspect-ratio α-Si pillar photonic crystalcoupled plasmonic waveguide for on-chip gas sensing

Zhai, Y., Dubois, F., Dao, T. D., Spettel, J., Sasaki, T., Jannesari, R., Pühringer, G., Andrianov, N., Vojkuvka, L., Fleury, C., Consani, C., Stocker, G., Grille, T., Saeidi, P., Jakoby, B., Moridi, M. & Tortschanoff, A., 2022.

Publikation: Konferenzbeitrag › Poster › Begutachtung

High Performance Acoustofluidic Particle Focusing in Silicon-Based and Polymer-Based Devices Using Lateral Modes of Plate Transducers

Fuchsluger, K., De Pastina, A., Cselyuszka, N., Andrianov, N., Roshanghias, A., Ecker, R., Mitteramskogler, K., Voglhuber-Brunnmaier, K., Moridi, M. & Jakoby, B., 20 Okt. 2022.

Publikation: Konferenzbeitrag › Abstract › Begutachtung

Low-density SiOC thin films grown by low temperature plasma-enhanced chemical vapor deposition for high performance acoustic Bragg mirrors

Pilz, J., Andrianov, N., Sinani, T., Azeem, S. M., Dao, T. D., Moridi, M. & Bruckner, G., 10 Nov. 2022.

Publikation: Konferenzbeitrag › Poster

Novel Piezoelectric MOEMS Platform

Lagosh, A., Zhai, Y., Risquez, S., De Pastina, A., Andrianov, N., Vojkuvka, L., Pribosek, J., Piot, A. & Moridi, M., 2022.

Publikation: Konferenzbeitrag › Poster › Begutachtung

ULTRA-FAST ACOUSTOFLUIDIC PARTICLE FOCUSING USING LATERAL MODES OF A PLATE TRANSDUCER

Fuchsluger, A., De Pastina, A., Mitteramskogler, T., Ecker, R., Voglhuber-Brunnmaier, T., Andrianov, N., Shatalov, A., Cselyuszka, N., Moridi, M. & Jakoby, B., 2022, (Angenommen/Im Druck) Transducers 2023: The 22nd International Conference on Solid-State Sensors, Actuators and Microsystems. Kyoto

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Utilizing Lateral Plate Transducer Modes for High Quality Acoustofluidics in Silicon-Based Chips

Fuchsluger, K., De Pastina, A., Nikolai, A., Roshanghias, A., Cselyuszka, N., Mitteramskogler, K., Ecker, K., Moridi, M. & Jakoby, B., 2022, Utilizing Lateral Plate Transducer Modes for High Quality Acoustofluidics in Silicon-Based Chips. S. 1 4 S.

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Open Access

Wide-spectral range DUV – MIR spectroscopic ellipsometry study of PECVD-grown silicon oxide and nitride thinfims: Wide-spectral range DUV – MIR spectroscopic ellipsometry study of PECVD-grown silicon oxide and nitride thinfims

Azeem, S. M., Spettel, J., Nikolai, A., Streque, J., Cassese, T., Pilz, J., Solonenko, D., Fleury, C., Dubois, F., Zhai, Y., Cselyuszka, N., Tortschanoff, A., Moridi, M. & Dao, T. D., 2022.

Publikation: Konferenzbeitrag › Poster › Begutachtung

2021

Engineering mode coupling in a hybrid plasmon-photonic cavity for dual-band infrared spectroscopic gas sensing

Dao, T. D., Dubois, F., Spettel, J., Tortschanoff, A., Fleury, C., Cselyuszka, N., Consani, C., Nikolai, A. & Moridi, M., 15 Juni 2021, in: OSA Continuum. 4, 6, S. 1827

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Open Access

Datei

2018

Enhanced silicon nitride etching in the presence of F atoms: Quantum chemistry simulation

Barsukov, Y. V., Volynets, V., Kobelev, A. A., Andrianov, N. A., Tulub, A. V. & Smirnov, A. S., Nov. 2018, in: Journal of Vacuum Science & Technology A. 36, 6, S. 061301-1-061301-6 6 S.

Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung