Ingenieurwesen & Materialwissenschaft
3D printers
17%
Actuators
9%
Adhesive pastes
23%
Adhesives
96%
Bending tests
5%
Biomedical equipment
15%
Coating techniques
16%
Conductive films
15%
Contact resistance
16%
Copper
29%
Costs
24%
Display devices
10%
Electric fields
16%
Electrodes
9%
Electronic equipment
84%
Electronic paper
38%
Electronics packaging
16%
Encapsulation
40%
Fabrication
33%
Fibers
24%
Gases
20%
Hot Temperature
11%
Humidity sensors
15%
Integrated circuits
6%
Intelligent systems
12%
Internet of things
7%
Labels
12%
Masks
11%
Metal foil
10%
Monitoring
46%
Multilayers
11%
Near field communication
70%
Networks (circuits)
6%
Paper coating
21%
Polypropylenes
72%
Power electronics
5%
Printed circuit boards
14%
Printing
100%
Radio frequency identification (RFID)
40%
Sensors
20%
Silicon
8%
Smart textiles
17%
Smartphones
16%
Soldering alloys
69%
Substrates
69%
Temperature
12%
Temperature control
5%
Tropics
15%
Water
19%
Wire
22%
Physik & Astronomy
adhesives
78%
chips
99%
circuit boards
8%
communication
5%
contact resistance
7%
cycles
27%
electrical properties
6%
electronics
62%
emerging
6%
fabrication
9%
flexibility
9%
foils
8%
kits
12%
mechanical properties
11%
performance
7%
polyethylene terephthalate
40%
polypropylene
36%
printed circuits
8%
printing
7%
reliability analysis
8%
robotics
10%
silicon
24%
silver
7%
soldering
11%
solders
39%
temperature
5%
thermodynamic properties
7%
tropical regions
12%
