DI Dr. Jochen Bardong

Suchergebnisse

• 2022

  Detachable Ultrasonic Data Communication Through the Metal plate with NFC Technology

  Abbaszadeh, J., Pashchenko, V., Gebhart, M., Travnik, A., Bardong, J. & Moridi, M., 10 Okt. 2022, 2022 IEEE International Ultrasonics Symposium (IUS).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Near field communication 100%
  • Plate metal 93%
  • Ultrasonics 60%
  • Metals 45%
  • Lead zirconate titanate 43%

• Through-Wall Acoustically Linked Temperature Sensor

  Pashchenko, V., Abbaszadeh, J., Travnik, A., Bardong, J. & Moridi, M., 10 Okt. 2022, 2022 IEEE International Ultrasonics Symposium (IUS). S. 1-4 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • temperature sensors 100%
  • temperature measurement 81%
  • transducers 72%
  • thermistors 57%
  • wall temperature 52%
• 2019

  Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices : Automated assembly of miniaturized PM sensor

  Pribosek, J., Zauner, M., Bardong, J., Binder, A., Maierhofer, P., Bergmann, A. & Röhrer, G., 30 Okt. 2019, 2019 IEEE SENSORS. S. 1-3 3 S. 8956807

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2018

  Wireless, direct pressure sensing with saw devices at elevated temperatures

  Bruckner, G., Bardong, J., Szász, P. & Oschkera, S., 2018, 2018 IEEE International Ultrasonics Symposium (IUS). S. 1-9 9 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2016

  Experimental investigations of the acousto-electric effect in high temperature SAW gas sensing

  Bruckner, G., Bardong, J., Postl, M. & Klug, A., 21 Sep. 2016, 2016 IEEE International Ultrasonics Symposium (IUS). S. 1-4 4 S. 7728736

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • high temperature gases 100%
  • sensors 53%
  • exhaust gases 38%
  • gases 14%

• Printed SAW transponder package for rapid prototyping of electronic packages

  Roshanghias, A., Krivec, M., Bardong, J., Abram, A. & Binder, A., 15 Sep. 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC). S. 1-4 4 S. 7764745

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2015

  B5.4 - First Investigation of LTCC package for high temperature SAW sensors

  Bardong, J., Binder, A., Toskov, S., Miskovic, G. & Radosavljevic, G., 1 Jän. 2015, in: Proceedings SENSOR 2015.

  Publikation: Beitrag in Fachzeitschrift › Konferenzartikel › Begutachtung

  Open Access

  Datei
• 2014

  A new method for fast and accurate determination of the temperature coefficients of material constants up to 700°C. Application to LGS

  Nicolay, P., Bardong, J. & Bruckner, G., 2014, 2014 IEEE International Ultrasonics Symposium. S. 289-292 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Temperature sensors 100%
  • Temperature 74%

• Investigation of platinum based periodic gratings on langasite

  Bruckner, G., Nicolay, P., Bardong, J. & Shaposhnikov, K., 6 Sep. 2014, 2014 IEEE International Ultrasonics Symposium. S. 2043-2046 4 S. 6932262

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • platinum 100%
  • gratings 74%
  • electrodes 63%
  • simulation 29%
  • delay lines 28%
• 2011

  Is AlN/Sapphire bilayer structure an alternative to langasite for ultra-high-temperature SAW applications?

  Aubert, T., Elmazria, O., Bardong, J., Bruckner, G. & Assouar, B., 21 Okt. 2011, 2011 IEEE International Ultrasonics Symposium. S. 2082-2085 4 S. 6293309

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • sapphire 100%
  • iridium 36%
  • in situ measurement 33%
  • temperature sensors 32%
  • guy wires 32%
• 2010

  High temperature packaging for SAW transponder

  Fachberger, R. & Bardong, J., 4 Juni 2010, 2010 IEEE International Frequency Control Symposium. S. 287-290 4 S. 5556325

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Transponders 100%
  • Packaging 74%
  • Adhesives 49%
  • Acoustic surface wave devices 42%
  • Thermal aging 34%

• Investigations of SAW delay lines on c-plane AlN/sapphire at elevated temperatures

  Bruckner, G., Bardong, J., Fachberger, R., Forsén, E. & Eisele, D., 4 Juni 2010, 2010 IEEE International Frequency Control Symposium. S. 499-502 4 S. 5556280

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • aluminum nitrides 100%
  • delay lines 97%
  • sapphire 74%
  • time response 53%
  • acoustics 50%
• 2009

  Characterisation setup of SAW devices at high temperatures and ultra high frequencies

  Bardong, J., Bruckner, G., Franz, G., Fachberger, R. & Erlacher, A., 24 Apr. 2009, 2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum. S. 28-32 5 S. 5168136

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • ultrahigh frequencies 100%
  • characterization 48%
  • coaxial cables 47%
  • tubes 37%
  • chips 27%

• Influence of packaging atmospheres on the durability of high-temperature SAW sensors

  Bardong, J., Bruckner, G., Kraft, M. & Fachberger, R., 2009, 2009 IEEE International Ultrasonics Symposium. S. 1680-1683 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2008

  Precise measurements of BAW and SAW properties of Langasite in the temperature range from 25°C to 1000°C

  Bardong, J., Schulz, M., Schmitt, M., Shrena, I., Eisele, D., Mayer, E., Reindl, L. M. & Fritze, H., 2008, 2008 IEEE International Frequency Control Symposium. S. 326-331 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • acoustics 100%
  • tensors 86%
  • thermogravimetry 74%
  • surface acoustic wave devices 73%
  • oscillations 73%
• 2007

  High temperature RFID system using passive SAW transponders

  Fachberger, R., Bruckner, G., Bardong, J. & Reindl, L., 2007, Proceedings of the European Microwave Association. Band 4. S. 194-200 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel