DI Dr. Jochen Bardong

Suchergebnisse

• 2022

  Detachable Ultrasonic Data Communication Through the Metal plate with NFC Technology

  Abbaszadeh, J., Pashchenko, V., Gebhart, M., Travnik, A., Bardong, J. & Moridi, M., 10 Okt. 2022, 2022 IEEE International Ultrasonics Symposium (IUS).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Near field communication 100%
  • Plate metal 93%
  • Ultrasonics 60%
  • Metals 45%
  • Lead zirconate titanate 43%

• Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging

  Roshanghias, A., Bardong, J. & Binder, A., 11 Apr. 2022, in: Materials.

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

  Open Access

  Datei

• Through-Wall Acoustically Linked Temperature Sensor

  Pashchenko, V., Abbaszadeh, J., Travnik, A., Bardong, J. & Moridi, M., 10 Okt. 2022, 2022 IEEE International Ultrasonics Symposium (IUS). S. 1-4 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • temperature sensors 100%
  • temperature measurement 81%
  • transducers 72%
  • thermistors 57%
  • wall temperature 52%
• 2021

  Sinterconnects: All-Copper Top-Side Interconnects Based on Copper Sinter Paste for Power Module Packaging

  Roshanghias, A., Malago, P., Kaczynski, J., Polom, T., Bardong, J., Holzmann, D., Malik, M-H., Ortner, M., Hirschl, C. & Binder, A., 13 Apr. 2021, in: Energies. 14, 8

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

  Open Access

  • Interconnect 100%
  • Packaging 95%
  • Copper 94%
  • Interconnection 50%
  • Module 45%
• 2020

  Vacuum-Assisted Selective Adhesive Imprinting for Photonic Packaging of Complex MOEMS Devices: Assembly of Miniaturized Particle Sensor

  Pribosek, J., Zauner, M., Bardong, J., Binder, A., Maierhofer, P., Bergmann, A. & Röhrer, G., 15 Jän. 2020, in: IEEE Sensors Journal. 20, 24, S. 15053-15060 8 S., 9146292.

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung
• 2019

  RFID-based Wireless Sensor Network for Semiconductor Manufacturing Equipment to enable Predictive Maintenance

  Moldaschl, T., Travnik, A., Frank, A., Bardong, J., Cramer, H., Kastberger, H., Weitlaner, M., Jerne, M., Nazarov, A. & Hirschl, C., Apr. 2019, in: Proceedings of the 13th international conference on Smart Systems Integration.

  Publikation: Beitrag in Fachzeitschrift › Artikel

  • Predictive maintenance 100%
  • Radio frequency identification (RFID) 73%
  • Semiconductor materials 69%
  • Wireless sensor networks 61%
  • Sensors 40%

• Vacuum-assisted selective adhesive imprinting for heterogeneous system integration of MOEMS devices : Automated assembly of miniaturized PM sensor

  Pribosek, J., Zauner, M., Bardong, J., Binder, A., Maierhofer, P., Bergmann, A. & Röhrer, G., 30 Okt. 2019, 2019 IEEE SENSORS. S. 1-3 3 S. 8956807

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

• Wireless readout of multiple SAW temperature sensors

  Bruckner, G. & Bardong, J., 2 Juli 2019, in: Sensors. 19, 14

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

  • Surface Acoustic Wave 100%
  • temperature sensors 79%
  • Surface waves 79%
  • Temperature sensors 76%
  • readout 64%
• 2018

  A novel interferometric characterization technique for 3D analyses at high pressures and temperatures

  Roshanghias, A., Bardong, J., Pulko, J. & Binder, A., 28 März 2018, in: Journal of Physics D: Applied Physics. 51, 16

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

  • characterization 100%
  • microelectromechanical systems 87%
  • topography 83%
  • glass 78%
  • interferometers 72%

• Wireless, direct pressure sensing with saw devices at elevated temperatures

  Bruckner, G., Bardong, J., Szász, P. & Oschkera, S., 2018, 2018 IEEE International Ultrasonics Symposium (IUS). S. 1-9 9 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2017

  Saw delay lines as wireless sensors for industrial applications

  Bruckner, G., Bardong, J., Binder, A. & Nicolay, P., 2017, 8th Conference on Smart Structures and Materials, SMART 2017 and 6th International Conference on Smart Materials and Nanotechnology in Engineering, SMN 2017. S. 1433-1443 11 S. (8th Conference on Smart Structures and Materials, SMART 2017 and 6th International Conference on Smart Materials and Nanotechnology in Engineering, SMN 2017; Band 2017-January).

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Kapitel › Begutachtung

  • delay lines 100%
  • power lines 62%
  • surface acoustic wave devices 57%
  • sensors 54%
  • slags 52%
• 2016

  Experimental investigations of the acousto-electric effect in high temperature SAW gas sensing

  Bruckner, G., Bardong, J., Postl, M. & Klug, A., 21 Sep. 2016, 2016 IEEE International Ultrasonics Symposium (IUS). S. 1-4 4 S. 7728736

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • high temperature gases 100%
  • sensors 53%
  • exhaust gases 38%
  • gases 14%

• Investigation of low-temperature cofired ceramics packages for high-temperature SAW sensors

  Bardong, J., Binder, A., Toskov, S., Miskovic, G. & Radosavljevic, G., 17 März 2016, in: Journal of Sensors and Sensor Systems. 5, 1, S. 85-93 9 S.

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

  Open Access

  • Surface waves 100%
  • Acoustic waves 70%
  • ceramics 60%
  • sensors 54%
  • acoustics 51%

• Multilayer Pt/Al based ohmic contacts for AlGaN/GaN heterostructures stable up to 600°C ambient air

  Goyal, N., Dusari, S., Bardong, J., Medjdoub, F., Kenda, A. & Binder, A., 1 Feb. 2016, in: Solid-State Electronics. 116, S. 107-110

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

• Printed SAW transponder package for rapid prototyping of electronic packages

  Roshanghias, A., Krivec, M., Bardong, J., Abram, A. & Binder, A., 15 Sep. 2016, 2016 6th Electronic System-Integration Technology Conference (ESTC). S. 1-4 4 S. 7764745

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
• 2015

  B5.4 - First Investigation of LTCC package for high temperature SAW sensors

  Bardong, J., Binder, A., Toskov, S., Miskovic, G. & Radosavljevic, G., 1 Jän. 2015, in: Proceedings SENSOR 2015.

  Publikation: Beitrag in Fachzeitschrift › Konferenzartikel › Begutachtung

  Open Access

  Datei
• 2014

  A new method for fast and accurate determination of the temperature coefficients of material constants up to 700°C. Application to LGS

  Nicolay, P., Bardong, J. & Bruckner, G., 2014, 2014 IEEE International Ultrasonics Symposium. S. 289-292 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Temperature sensors 100%
  • Temperature 74%

• Design and characterisation of a combined pressure, temperature, ID sensor for harsh environment

  Binder, A., Bardong, J. & Bruckner, G., Sep. 2014, S. 1513-1516.

  Publikation: Konferenzbeitrag › Papier › Begutachtung

• Development of a Low Cost, Miniature Thermal Conductivity Vacuum Gauge for Integration Purposes

  Lenzhofer, M., Bardong, J., Nicolay, P. & Kenda, A., Aug. 2014, in: International Journal of Computer and Electronics Research. 2014, 4, S. 177 - 180

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

• Investigation of platinum based periodic gratings on langasite

  Bruckner, G., Nicolay, P., Bardong, J. & Shaposhnikov, K., 6 Sep. 2014, 2014 IEEE International Ultrasonics Symposium. S. 2043-2046 4 S. 6932262

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • platinum 100%
  • gratings 74%
  • electrodes 63%
  • simulation 29%
  • delay lines 28%
• 2012

  Iridium interdigital transducers for high-temperature surface acoustic wave applications

  Aubert, T., Bardong, J., Elmazria, O., Bruckner, G. & Assouar, B., 1 Feb. 2012, in: IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control. 59, 2, S. 194-197 4 S., 6156820.

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

  • Iridium 100%
  • interdigital transducers 89%
  • iridium 83%
  • Surface waves 75%
  • Transducers 64%
• 2011

  Is AlN/Sapphire bilayer structure an alternative to langasite for ultra-high-temperature SAW applications?

  Aubert, T., Elmazria, O., Bardong, J., Bruckner, G. & Assouar, B., 21 Okt. 2011, 2011 IEEE International Ultrasonics Symposium. S. 2082-2085 4 S. 6293309

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • sapphire 100%
  • iridium 36%
  • in situ measurement 33%
  • temperature sensors 32%
  • guy wires 32%
• 2010

  High temperature packaging for SAW transponder

  Fachberger, R. & Bardong, J., 4 Juni 2010, 2010 IEEE International Frequency Control Symposium. S. 287-290 4 S. 5556325

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • Transponders 100%
  • Packaging 74%
  • Adhesives 49%
  • Acoustic surface wave devices 42%
  • Thermal aging 34%

• Investigations of SAW delay lines on c-plane AlN/sapphire at elevated temperatures

  Bruckner, G., Bardong, J., Fachberger, R., Forsén, E. & Eisele, D., 4 Juni 2010, 2010 IEEE International Frequency Control Symposium. S. 499-502 4 S. 5556280

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • aluminum nitrides 100%
  • delay lines 97%
  • sapphire 74%
  • time response 53%
  • acoustics 50%
• 2009

  Characterisation setup of SAW devices at high temperatures and ultra high frequencies

  Bardong, J., Bruckner, G., Franz, G., Fachberger, R. & Erlacher, A., 24 Apr. 2009, 2009 IEEE International Frequency Control Symposium Joint with the 22nd European Frequency and Time forum. S. 28-32 5 S. 5168136

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • ultrahigh frequencies 100%
  • characterization 48%
  • coaxial cables 47%
  • tubes 37%
  • chips 27%

• Influence of packaging atmospheres on the durability of high-temperature SAW sensors

  Bardong, J., Bruckner, G., Kraft, M. & Fachberger, R., 2009, 2009 IEEE International Ultrasonics Symposium. S. 1680-1683 4 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel
• 2008

  High-Temperature Measurements on SAW-Substrate Langasite

  Bardong, J., Mayer, E. & Reindl, L., 1 März 2008, in: EFTF 2008 - 22nd European Frequency and Time Forum conference proceedings. 1 S.

  Publikation: Beitrag in Fachzeitschrift › Artikel › Begutachtung

  • Temperature measurement 100%
  • Substrates 66%
  • Phase velocity 64%
  • High temperature applications 60%
  • Temperature 37%

• Integriertes SAW RF-ID & Sensorsystem für hohe Temperaturen

  Bardong, J., 16 Juli 2008.

  Publikation: Konferenzbeitrag › Papier

  Open Access

  Datei

• Precise measurements of BAW and SAW properties of Langasite in the temperature range from 25°C to 1000°C

  Bardong, J., Schulz, M., Schmitt, M., Shrena, I., Eisele, D., Mayer, E., Reindl, L. M. & Fritze, H., 2008, 2008 IEEE International Frequency Control Symposium. S. 326-331 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

  • acoustics 100%
  • tensors 86%
  • thermogravimetry 74%
  • surface acoustic wave devices 73%
  • oscillations 73%
• 2007

  High temperature RFID system using passive SAW transponders

  Fachberger, R., Bruckner, G., Bardong, J. & Reindl, L., 2007, Proceedings of the European Microwave Association. Band 4. S. 194-200 6 S.

  Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel