Physik & Astronomy
chips
93%
gyroscopes
74%
packaging
70%
microelectronics
68%
wafers
67%
microelectromechanical systems
65%
vapors
50%
nuclear magnetic resonance
40%
cells
36%
coplanarity
36%
silicon
27%
electronics
26%
gases
25%
costs
25%
robotics
19%
adhesives
16%
gas flow
15%
silver
13%
thermodynamic properties
13%
chambers
13%
budgets
12%
mechanical properties
11%
cycles
11%
fabrication
10%
glass
9%
ultrasonics
8%
performance
7%
vibration
7%
causes
6%
simulation
6%
Mathematik
Interconnect
100%
Packaging
95%
Copper
94%
Interconnection
50%
Module
45%
Thermal Management
23%
Power Electronics
18%
High Power
13%
Performance
13%
Substitute
13%
Finite Element Analysis
12%
Die
12%
Contact
9%
Ingenieurwesen & Materialwissenschaft
Topography
75%
Copper
61%
Wire
25%
Chemical mechanical polishing
21%
Electronics packaging
14%
Temperature control
10%
Hot Temperature
10%
Power electronics
10%
Electric properties
8%
Finite element method
6%
Temperature
6%
Fabrication
6%
