DI DI Dr. Christian Mentin, BSc.

Leiter der Forschungsgruppe, Packaging & Multiphysics (PM)
Senior Manager, Packaging & Multiphysics (PM)

Frühere Beschäftigte

Leiter der Forschungsgruppe, Packaging & Multiphysics (PM)
SENIOR WISSENSCHAFTLER, Instrumentation & Testing (IT)
Senior Manager, Packaging & Multiphysics (PM)

https://orcid.org/0000-0002-3622-0457

5 Konferenzartikel
1 Papier
1 Poster

5 Ergebnisse

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2023
Tiny Power Box – Mechanical Investigations for Automotive Very High Power Density Onboard Chargers
Recepi, I., Mentin, C., Matzick, P. & Garcia Mora, R. A., 4 Juli 2023, PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. S. 1-9 9 S. 10173332
Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
2022

Tiny Power Box - Exploiting Multiport Series Resonant Topologies for Very High Power Density Onboard Chargers
Vollmaier, F., Langbauer, T., Pajnic, M., Connaughton, A. M., Konrad, W., Mentin, C. & Recepi, I., 10 Mai 2022, PCIM Europe 2022 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. VDE Verlag GmbH, S. 1-9
Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
Tiny Power Box - Thermal Investigations for Very High Power Density Onboard Chargers
Mentin, C., Recepi, I. & Matzick, P., 30 Sep. 2022, 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). S. 1-6 6 S. 9950663
Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
2020
High Fidelity Package Simulation Models Capturing Accurate Thermal Cross-Coupling
Mentin, C., Recepi, I. & Polom, T., 9 Okt. 2020, 2020 26th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). S. 97-103 7 S. 9420498
Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung
2019

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions
Langbauer, T., Mentin, C., Rindler, M., Vollmaier, F., Connaughton, A. & Krischan, K., 27 Sep. 2019, 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC). S. 1-6 6 S. 8923595
Publikation: Konferenzband/Beitrag in Buch/Bericht › Konferenzartikel › Begutachtung

DI DI Dr. Christian Mentin, BSc.

Publikationen

Suchergebnisse

Tiny Power Box – Mechanical Investigations for Automotive Very High Power Density Onboard Chargers

Tiny Power Box - Exploiting Multiport Series Resonant Topologies for Very High Power Density Onboard Chargers

Tiny Power Box - Thermal Investigations for Very High Power Density Onboard Chargers

High Fidelity Package Simulation Models Capturing Accurate Thermal Cross-Coupling

Closing the Loop between Circuit and Thermal Simulation: A System Level Co-Simulation for Loss Related Electro-Thermal Interactions