DI DI Dr. Christian Mentin, BSc.

Ingenieurwesen & Materialwissenschaft

1. Semiconductor materials 100%
2. Cooling 63%
3. Hot Temperature 50%
4. Cooling systems 48%
5. Image reconstruction 43%
6. Power electronics 37%
7. Heat transfer 35%
8. Printed circuit boards 31%
9. Surface mount technology 24%
10. Energy gap 24%
11. Packaging 22%
12. Switching frequency 21%
13. Ceramic capacitors 15%
14. Semiconductor switches 14%
15. Power semiconductor devices 14%
16. Systems analysis 13%
17. Encapsulation 12%
18. Power converters 10%
19. Frequency response 9%
20. Wire 7%
21. Acoustic impedance 7%
22. Electric potential 7%
23. Image processing 5%