Physik & Astronomy
chips
100%
adhesives
52%
solders
51%
packaging
34%
gyroscopes
29%
polypropylene
27%
microelectronics
26%
wafers
26%
microelectromechanical systems
25%
sintering
20%
vapors
20%
nuclear magnetic resonance
15%
cells
14%
coplanarity
14%
budgets
11%
electronics
11%
thermal cycling tests
10%
gases
10%
costs
10%
electromigration
7%
caps
7%
printed circuits
6%
circuit boards
6%
stations
6%
gas flow
6%
intermetallics
5%
platforms
5%
contact resistance
5%
chambers
5%
performance
5%
printing
5%
gold
5%
Ingenieurwesen & Materialwissenschaft
Polypropylenes
53%
Soldering alloys
51%
Adhesives
47%
Substrates
37%
Radio frequency identification (RFID)
30%
Topography
29%
Electronic equipment
17%
Adhesive pastes
17%
Paper coating
16%
Near field communication
14%
Contact resistance
12%
Biomedical equipment
11%
Printed circuit boards
10%
Fabrication
10%
Printing
10%
Labels
9%
Chemical mechanical polishing
8%
Display devices
8%
Temperature
6%
Chemische Bestandteile
Solder
32%
Polishing
15%
Poly(propylene)
15%
Adhesive Film
13%
Contact Resistance
11%
Electrical Property
11%
Strength
8%
Communication
8%
Label
7%
Pressure
7%
Green
6%
Application
5%
Reaction Yield
5%
Coating Agent
5%
