Ingenieurwesen & Materialwissenschaft
Surface waves
95%
Near field communication
93%
Acoustic waves
77%
Sensors
75%
Printing
70%
Semiconductor materials
68%
Acoustic impedance
63%
Hot Temperature
56%
Temperature
54%
Substrates
54%
Electromagnetic compatibility
53%
Equivalent circuits
47%
Temperature sensors
45%
Electronic equipment
43%
Frequency response
42%
Electric potential
40%
Power electronics
38%
Printed circuit boards
38%
Transponders
38%
Scattering parameters
38%
3D printers
36%
Fabrication
36%
Monitoring
35%
Multilayers
33%
Electrohydrodynamics
33%
Radio frequency identification (RFID)
33%
Adhesives
33%
Soldering alloys
32%
Power transistors
31%
Resonators
31%
Electric vehicles
30%
Battery Pack
29%
Packaging
29%
Temperature measurement
28%
Wireless power transfer
28%
Capacitors
28%
Networks (circuits)
28%
Microstrip antennas
27%
Acoustic surface wave devices
26%
Energy management
25%
Polypropylenes
25%
Silicon
24%
Inductance
23%
Antennas
23%
High temperature applications
23%
Gallium
23%
Curing
23%
Polychlorinated biphenyls
22%
Copper
21%
Circuit simulation
20%
Neural networks
20%
Distributed power generation
20%
Electric bikes
20%
Costs
20%
Power inductors
19%
Signal interference
19%
Phototransistors
19%
Electroporation
19%
Cooling
18%
Controllers
18%
Digital twin
17%
Silver nanoparticles
17%
Ink
17%
Encapsulation
17%
Shielding
17%
High frequency transformers
16%
Heat transfer
16%
Identification (control systems)
16%
SPICE
16%
Hearing aids
16%
Plate metal
16%
Power MOSFET
15%
Predictive maintenance
15%
Pressure sensors
15%
Coaxial cables
15%
Finite element method
15%
Electric delay lines
15%
Communication systems
15%
Electric network topology
15%
Ceramic capacitors
15%
Computer simulation
15%
Electromagnetic simulation
15%
Charging (batteries)
14%
Metallizing
14%
Grippers
14%
Patents and inventions
14%
Topology
14%
Communication
14%
3D modeling
14%
Cooling systems
14%
Ultrasonics
14%
Topography
13%
Medical applications
13%
Wire
13%
Low pass filters
13%
Electronic paper
13%
Phase shift
13%
Transistors
13%
End effectors
13%
Electric current control
12%
Physik & Astronomy
chips
100%
acoustics
58%
temperature sensors
58%
sensors
52%
adhesives
44%
solders
44%
temperature
44%
packaging
43%
silicon
40%
performance
36%
electronics
34%
wafers
34%
transducers
33%
microelectromechanical systems
31%
radio frequencies
26%
glass
24%
surface acoustic wave devices
24%
readout
22%
simulation
21%
characterization
21%
end effectors
19%
gallium nitrides
19%
delay lines
18%
assembly
18%
membranes
18%
ceramics
17%
evaluation
17%
polychlorinated biphenyls
16%
tellurides
16%
microstructure
16%
thermal simulation
15%
laser-induced breakdown spectroscopy
15%
thin films
15%
methodology
14%
connectors
14%
Rayleigh waves
14%
eutectics
14%
polyethylene terephthalate
13%
gyroscopes
13%
pressure sensors
13%
cycles
13%
curing
13%
fluids
12%
modules
12%
gallium
12%
polypropylene
12%
impedance
12%
microelectronics
12%
copper
12%
radiant flux density
12%
ellipsometry
12%
silicon nitrides
12%
silicon carbides
11%
metal oxides
11%
ignition
11%
temperature measurement
11%
YAG lasers
11%
photometers
10%
chutes
10%
antennas
10%
silver
10%
high electron mobility transistors
10%
masks
10%
printing
10%
costs
10%
adhesion
10%
transition metals
10%
fabrication
10%
solid solutions
10%
manufacturing
10%
pixels
9%
mechanical properties
9%
ignition systems
9%
transistors
9%
wavelengths
9%
sintering
9%
gases
9%
igniters
9%
etching
9%
vapors
9%
amplifier design
9%
systems-on-a-chip
9%
cooling
9%
polymers
8%
power lines
8%
actuation
8%
assemblies
8%
crystals
8%
gold
8%
thermistors
7%
oscillations
7%
vacuum
7%
industries
7%
yttrium
7%
emerging
7%
resonators
7%
cells
7%
cavities
7%
cathodes
7%