Ingenieurwesen & Materialwissenschaft
Hot Temperature
100%
Semiconductor materials
97%
Power electronics
81%
Frequency response
70%
Energy management
52%
Electric vehicles
47%
Electric potential
44%
Distributed power generation
43%
Electric bikes
42%
Cooling
38%
Controllers
38%
Digital twin
37%
High frequency transformers
35%
Heat transfer
35%
Identification (control systems)
34%
Power MOSFET
33%
Electric network topology
31%
Charging (batteries)
31%
Cooling systems
29%
Acoustic impedance
28%
Phase shift
27%
Topology
26%
Image reconstruction
26%
DC-DC converters
26%
Model predictive control
25%
Microcontrollers
25%
Fault detection
24%
Solar energy
23%
Sensitivity analysis
22%
Failure modes
22%
Networks (circuits)
22%
Variable speed drives
22%
Wire
22%
Voltage control
22%
Copper
21%
Silicon
20%
Buffer storage
20%
Printed circuit boards
19%
Ceramic capacitors
19%
Capacitors
18%
Computer hardware
18%
Step response
18%
Polychlorinated biphenyls
18%
Model reference adaptive control
16%
Financial markets
15%
Transfer learning
15%
Surface mount technology
15%
Energy gap
14%
Temperature
14%
Electric commutation
14%
Packaging
13%
Testing
13%
Switching frequency
13%
Costs
13%
Physics
13%
Fuzzy control
12%
Zero voltage switching
12%
Power converters
12%
Calibration
11%
Magnetic couplings
11%
Damping
11%
Profitability
11%
Resonant circuits
11%
Poles
11%
Degradation
10%
Electricity
10%
Waveform analysis
9%
Heating
9%
Classifiers
9%
Semiconductor switches
9%
Power semiconductor devices
8%
DC transformers
8%
Systems analysis
8%
Pulse width modulation
7%
Dynamic analysis
7%
Permanent magnets
7%
Encapsulation
7%
Computer simulation
7%
Aging of materials
6%
Scaling laws
6%
Sensors
6%
Transformer windings
6%
Torque
6%
Magnetization
6%
Inductance
6%
Semiconductor devices
6%
Transistors
5%
Electronics packaging
5%
Stabilization
5%
Electric power systems
5%
Experiments
5%
Finite element method
5%
Thermal gradients
5%
Physik & Astronomy
gallium nitrides
30%
thermal simulation
29%
silicon carbides
24%
packaging
24%
radiant flux density
23%
systems-on-a-chip
19%
cooling
17%
simulation
15%
power loss
15%
thermal analysis
14%
characterization
14%
thermal resistance
14%
viability
14%
electronics
13%
high electron mobility transistors
13%
temperature
12%
systems simulation
11%
theses
10%
temperature effects
7%
fluids
7%
assembly
7%
margins
5%
temperature profiles
5%